Diabetic Living No Bake Pumpkin Cheesecake - cooking recipe

Ingredients

Graham Cracker Crust
3/4 cup graham cracker, finely crushed
3 tablespoons canola oil
2 tablespoons Splenda sugar substitute, equivalent to 2 tablespoons sugar
Pie
1 (1/4 ounce) envelope unflavored gelatin
1/4 cup water
1.5 (8 ounce) containers light cream cheese
1 (15 ounce) can pumpkin
2 tablespoons Splenda sugar substitute, equivalent to 2 tablespoons sugar
1 teaspoon ground cinnamon
3/4 of an 8-ounce container frozen light whipped dessert topping, thawed
frozen light whipped dessert topping, thawed (optional)
ground cinnamon, chopped pecans, and (optional) or pomegranate, seeds** (optional)

Preparation

To make crust - Preheat oven to 350 degrees F. In a small bowl, combine crushed graham crackers, canola oil, and sugar. Mix well. Spread evenly in bottom of an 8- or 9-inch springform pan; press firmly onto bottom. Bake for 5 minutes. Cool on a wire rack.
To make pie - In a small saucepan, stir together gelatin and the water; let stand for 5 minutes to soften. Cook and stir over low heat until gelatin dissolves; set aside to cool slightly.
In a large bowl, beat cream cheese with an electric mixer on medium speed until smooth. Add pumpkin, sugar, the 1 teaspoon cinnamon, and the gelatin mixture; beat until well mixed. Fold in the three-quarters container of dessert topping. Spread mixture into crust in springform pan. Cover and refrigerate for 4 to 24 hours or until set.
Using a thin metal spatula or table knife, loosen the cheesecake from the side of the springform pan. If desired, use a wide spatula to remove cheesecake from bottom of pan and place on a serving plate. Cut into wedges to serve. If desired, top with additional whipped topping. If desired, garnish with additional cinnamon, chopped pecans, and/or pomegranate seeds.
Tip
*Sugar Substitutes: Choose from Splenda(R) Granular, Equal(R) Spoonful or packets, or Sweet 'N Low(R) bulk or packets. Follow package directions to use product amount equivalent to 2 tablespoons sugar for both crust and filling.